The Axcelis GSD200 is a batch high-current ion implanter used to introduce controlled dopant ions into semiconductor wafers. The available equipment listing identifies the system for 150 mm and 200 mm wafer processing.
GSD-series systems are generally used for production processes requiring relatively high implant doses and controlled wafer-level dose uniformity. The actual energy range, beam current, ion species, source configuration and wafer-handling setup must be confirmed on the individual machine.
Axcelis GSD200 Main Specifications
| Manufacturer | Axcelis Technologies |
|---|---|
| Model | GSD200 |
| Equipment Type | Batch High-Current Ion Implanter |
| Supported Wafer Sizes | 150 mm and 200 mm, according to the available equipment listing |
| Implant Current Class | High current |
| Wafer Processing Method | Batch implantation using a rotating wafer disk or end-station assembly, depending on configuration |
| Ion Source | Installed source type and source-head configuration must be confirmed |
| Extraction and Beamline | Configuration-dependent; voltage range and installed beamline components must be verified |
| Dopant Gas Configuration | Gas box, gas lines and approved dopant species must be confirmed from the available system |
| Wafer Handling | Cassette, aligner, robot and vacuum-transfer configuration must be inspected |
| Process Control | Recipe, beam monitoring and dose-control configuration depend on the installed controller |
| Condition | Used semiconductor equipment |
| Availability | Subject to current stock, inspection and configuration confirmation |
Key Equipment Features
Batch high-current ion implantation platform
Listed support for 150 mm and 200 mm wafers
Controlled ion-beam generation and mass analysis
Wafer dose monitoring and process recipe control
Configuration-dependent wafer tilt and implant-angle control
Suitable for established semiconductor implantation lines
Typical Applications
The GSD200 may be considered for high-dose semiconductor doping processes, including source and drain formation, contact-region doping and other production implants requiring high beam current.
Possible dopant species may include boron, phosphorus, arsenic or other approved materials, but compatibility depends on the installed ion source, gas system, beamline, contamination history and qualified process recipes.
Used Equipment Configuration and Inspection
The GSD200 platform was supplied in different wafer-size, source, gas and wafer-handling configurations. The model name alone does not confirm implant energy, maximum beam current, supported dopant gases or the number of wafers on the process disk.
Before quotation, customers should confirm the serial number, ion source, extraction assembly, analyzing magnet, beamline, Faraday system, wafer disk, cooling system, robot, gas boxes, vacuum pumps, controller, software and current power-on condition.
Request Axcelis GSD200 Information
Contact our team to check the current availability of the used Axcelis GSD200. Please provide your wafer size, dopant species, required implant energy, dose range, target process and installation location.
Contact us for equipment photos, installed beamline configuration, gas setup, inspection status and quotation.
Frequently Asked Questions
Is the Axcelis GSD200 a high-current ion implanter?
Yes. The available equipment listing identifies the GSD200 as a high-current ion implantation system.
What wafer sizes can the GSD200 process?
The source listing identifies support for 150 mm and 200 mm wafers. The installed wafer disk, cassettes, robot and aligner should be checked for the required size.
What dopant species can the GSD200 implant?
The usable species depend on the installed ion source, gas box, beamline materials and contamination-control requirements. The gas configuration must be verified before confirming a process.
What should be inspected before purchasing a used GSD200?
Important checks include the ion source, extraction components, analyzing magnet, wafer disk, cooling, dose control, robot, vacuum pumps, gas cabinets, software and available process records.