The BESI Datacon 2200 APM is an earlier Datacon 2200-series die bonder used for die attach, flip chip and multi-chip assembly. Buyers searching for a BESI 2200 or BESI Datacon 2200 may encounter APM, APM+ and later EVO-generation machines, so the exact suffix should be confirmed before specifications, condition or price are compared.
BESI 2200 APM: Confirm the Model Before Comparing Machines
The short name “Datacon 2200” is not specific enough for a used-equipment purchase. The 2200 APM is a real historical model, while APM+ machines also appear separately and BESI's later 2200 family is built around the Datacon 2200 EVO platform.
That distinction matters when comparing used equipment. Specifications published for a 2200 EVO should not automatically be assigned to a 2200 APM. The machine label, installed heads, wafer handling, tooling and actual configuration should be checked first.
What the Datacon 2200 APM Was Built to Do
The Datacon 2200 APM was developed as a configurable multi-chip die bonding platform for semiconductor assembly. Historical equipment information describes support for die attach and flip chip work, with machine configurations that may include dispensing, wafer handling, vision and automatic tool handling.
For a used machine, the value of the platform depends less on the model name alone and more on whether the installed configuration matches the intended process.
BESI Datacon 2200 APM Specifications
| Specification | BESI / Datacon 2200 APM |
|---|---|
| Equipment Type | Multi-Chip Die Bonder |
| Primary Processes | Die Attach / Flip Chip |
| Placement Accuracy | ±10 μm documented production reference* |
| Theta Placement | ±1° documented production reference* |
| Wafer Handling | Up to 12 in. / 300 mm configurations documented |
| Dispensing | Integrated dispenser configurations documented |
| Tool Handling | Automatic tool changer configurations documented |
| Vision | Substrate camera / pattern recognition |
| Machine Configuration | Configuration varies by individual used machine |
| Equipment Status | Legacy platform primarily sourced as used equipment |
*Published information for the original 2200 APM is limited. Placement figures above are supported by documented production use, while wafer handling, dispensing, tooling and other installed options should be confirmed from the individual machine.
BESI 2200 APM vs Datacon 2200 EVO
The APM and EVO names belong to the broader Datacon 2200 history, but they should not be treated as the same machine. The 2200 APM is an earlier used-equipment model. The Datacon 2200 EVO is the later Multi Module Attach platform documented by BESI for die attach, flip chip and multi-chip production.
| Model | How to Read It | Buying Direction |
|---|---|---|
| Datacon 2200 APM | Earlier 2200-series die bonder found mainly on the used-equipment market. | Consider it when an available machine has the required installed configuration and the project does not specifically require a later EVO-generation platform. |
| Datacon 2200 EVO | Later BESI Multi Module Attach platform with current manufacturer documentation and multiple EVO-family versions. | Consider it when a later platform, broader documented configuration options or a specific EVO-family capability is required. |
If you are specifically looking for the later platform, see the BESI Datacon 2200 EVO page rather than treating the APM and EVO as interchangeable.
Used BESI 2200 Price and Availability
Used BESI 2200 APM machines are normally sold by quotation rather than at one dependable public price. Machine year, condition, installed modules, wafer handling, dispenser, tooling, refurbishment scope and destination can all affect the final quotation.
When comparing a used 2200 APM, confirm the installed head, wafer handling, dispenser, vision, tooling and software from the actual machine rather than assuming every 2200 APM has the same configuration.
If you are searching for a BESI 2200 for sale, provide the exact model or machine label, preferred condition, quantity and destination so the available equipment can be identified correctly before price comparisons are made.
BESI Datacon 2200 APM FAQ
Is BESI 2200 the same as Datacon 2200 APM?
Not always. “BESI 2200” and “BESI Datacon 2200” are broad search terms. The actual machine may be a 2200 APM, APM+, a later 2200 EVO version or another 2200-series configuration. The exact suffix should be confirmed from the machine or documentation.
Is the Datacon 2200 APM available used?
Yes. Used 2200 APM machines continue to appear on the secondary semiconductor-equipment market, although availability, year, condition and installed options vary.
Can the Datacon 2200 APM be used for die attach and flip chip?
Historical equipment information identifies the Datacon 2200 platform as a multi-chip die bonder with flexibility for die attach and flip chip applications. The actual process capability of a used machine still depends on its installed hardware and tooling.
How much does a used BESI Datacon 2200 APM cost?
There is no single dependable market price. Quotes vary with machine year, condition, configuration, included tooling and refurbishment scope.
What should I check before buying a 2200 APM?
Confirm the exact model suffix first, then review the installed head, wafer handling, dispenser, substrate handling, vision, tooling, software and overall machine condition.
BESI Datacon 2200 APM Buying Summary
The BESI Datacon 2200 APM remains relevant mainly as a used-equipment option for buyers who need an earlier Datacon 2200-series die bonder and can match the available machine to their actual die attach or flip chip requirements. Before comparing price, confirm the exact model suffix, installed configuration, wafer handling, dispenser, vision, tooling, software and overall machine condition. Buyers who specifically need the later BESI 2200 platform should compare the BESI Datacon 2200 EVO separately.
