The Besi Datacon 8800 FC QUANTUM advanced is a high-volume flip chip bonder developed for mass-reflow flip chip assembly.
The machine combines precision die placement, flux application and process inspection. Its published placement accuracy is ±5 µm at 3 sigma, with production output of up to 10,000 units per hour depending on the application.
The 8800 FC QUANTUM advanced supports wafers from 4 to 12 inches and die sizes from 0.3 to 20 mm. Actual production capability depends on the wafer handler, substrate handling, fluxing system, cameras, software and product tooling installed on the individual machine.
Datacon 8800 FC QUANTUM Advanced Specifications
| Manufacturer | Besi / Datacon |
|---|---|
| Model | Datacon 8800 FC QUANTUM advanced |
| Equipment Type | Automatic flip chip bonder |
| Primary Process | Mass-reflow flip chip assembly |
| X/Y Placement Accuracy | ±5 µm at 3 sigma |
| Throughput | Up to 10,000 units per hour, application dependent |
| Bond Force | 2 to 50 N |
| Low-Force Option | 0.5 to 10 N |
| Die Size | 0.3 to 20 mm |
| Die Thickness | 50 µm to 3 mm |
| Wafer Size | 4 to 12 inches |
| Wafer Frames | 8-inch or 12-inch wafer frames |
| Substrate Working Range | 13 × 8 inches |
| Vision Field of View | 12 × 12 mm for substrate, wafer and upward-looking cameras |
| Machine Dimensions | 1,600 × 1,200 × 1,940 mm |
| Machine Weight | Approximately 2,000 kg |
These are published specifications for the Datacon 8800 FC QUANTUM advanced. They should not be applied to FC QUANTUM sigma, hS, advX or an unidentified 8800-series machine.
Process and Material Handling
The machine is designed for flip chip assembly using singulated substrates in boats, strips, leadframes or wafers in carriers.
Its glass-based CRYSTAL fluxing system applies flux before placement and supports simultaneous inspection. Available inspection functions include upward-looking vision, post-bond inspection and the Pseudo X-Ray process-control function.
Mass-reflow flip chip assembly
Wafer-to-substrate die placement
Strip and leadframe assembly
Singulated substrates loaded in boats
Wafer-in-carrier applications
Flux application and inspection
Post-bond inspection
Supported products and production output depend on the die, substrate, bump structure, flux material, wafer map and tooling used for the process.
Machine Configuration
Before purchasing a used 8800 FC QUANTUM advanced, check the machine identification and installed configuration.
Complete model designation and serial number
Machine year and software version
Wafer handler and supported wafer-frame sizes
Substrate loader and unloading configuration
CRYSTAL fluxer and installed cavity plates
Bond head and available bond-force range
Wafer, substrate and upward-looking cameras
Post-bond inspection hardware
Pseudo X-Ray function
Wafer mapping and product recipe software
Barcode or product-tracking options
Product tooling, boats, carriers and fixtures
Manuals, software backups and spare parts
A front-panel photograph showing only “Datacon 8800 FC QUANTUM” is not enough to confirm that the machine is the advanced version. The suffix should be verified from the nameplate, original documentation or machine software.
Condition and Inspection
Inspection of a used machine should cover the functions that affect placement accuracy, flux transfer and material handling.
Power-up and software startup
X, Y, Z and theta-axis movement
Bond head operation and force control
Wafer loading and wafer-table movement
Substrate loading and unloading
Camera image, lighting and alignment
Fluxer condition and cavity-plate availability
Upward-looking and post-bond inspection
Vacuum, pneumatic and safety systems
Current alarms and error history
Condition of included tooling and fixtures
If an on-site inspection is not available, request a recent power-on video, machine photographs, configuration list and available test results.
Availability and Quotation
Availability and configuration vary between individual machines. To check a Besi Datacon 8800 FC QUANTUM advanced, send the die size, wafer size, substrate format, required throughput, bonding force, flux material, quantity and destination.
If you already have a machine photograph, nameplate, serial number or option list, include it with the enquiry so that the exact model and installed equipment can be confirmed before quotation.
View more available flip chip bonders for semiconductor assembly.
