The Besi Datacon 8800 CHAMEO ultra plus AC is a high-accuracy hybrid bonding platform for die-to-wafer assembly. It is designed for advanced packaging applications that require precise alignment, strict particle control and automated 12-inch wafer handling.
Besi specifies system accuracy of 100 nm @ 3σ, an ISO 3 working area and dry-cycle throughput of up to 2,000 components per hour. The machine supports die sizes from 0.5 × 0.5 mm to 33 × 28 mm and die thicknesses from 25 μm to 800 μm.
Machine configuration may vary. Contact us for current availability, equipment photos, installed modules and location.
Datacon 8800 CHAMEO Ultra Plus AC Specifications
| Manufacturer | Besi |
|---|---|
| Model | Datacon 8800 CHAMEO ultra plus AC |
| Equipment Type | Hybrid bonding system |
| Primary Process | Die-to-wafer hybrid bonding |
| System Accuracy | 100 nm @ 3σ, alignment worst corner GOG |
| Cleanliness | ISO 3 in the working area |
| Maximum Throughput | Up to 2,000 CPH, dry cycle |
| Substrate Wafer | 12-inch wafer through EFEM |
| Substrate Wafer Thickness | 0.5 to 2.0 mm |
| Component Supply | 12-inch film frame or 12-inch wafer carrier |
| Carrier Material | Silicon or glass |
| Die Size | 0.5 × 0.5 mm to 33 × 28 mm |
| Die Thickness | 25 μm to 800 μm |
| Die Ejection | Needle, multi-stage or UV on request |
These are platform specifications. The EFEM, inspection system, die-ejection method, tool changer, automation interface and other installed modules must be confirmed for each machine.
System Capabilities
High-resolution alignment: the Van Gogh optical alignment system supports 100 nm-class die placement.
Controlled working area: ISO 3 cleanliness helps protect prepared bonding surfaces from particle contamination.
Inline IR inspection: placement can be checked without unloading the material from the system.
Thin-die handling: supports die thicknesses down to 25 μm and different die-ejection methods.
Multi-chip handling: integrated tool-changing options support different die formats within the production setup.
Factory automation: host communication, automatic product changeover and process data interfaces are available.
Flexible installation: the platform can be configured as a stand-alone bonder with EFEM loading or integrated into a cluster system.
Applications
The Datacon 8800 CHAMEO ultra plus AC is intended for advanced packages that require fine die-to-wafer alignment and a clean bonding environment. Typical applications include:
Die-to-wafer hybrid bonding
High-density semiconductor interconnects
Three-dimensional device integration
Thin-die stacking
Multi-chip advanced packaging
High-end logic, memory and heterogeneous integration modules
The incoming die and wafer surfaces must be prepared for the intended hybrid bonding process. Surface preparation, metrology and upstream cleaning equipment are separate parts of the complete production flow.
View related advanced packaging and hybrid bonding solutions.
Machine Configuration
Available machines may differ in EFEM setup, component supply, die-ejection hardware, inline IR inspection, tool-changing system, automation interface and cluster integration.
For an available unit, we can provide the known machine year, location, condition, equipment photos and installed configuration. Testing or inspection information will be supplied when available.
Availability and Quotation
Contact us for current availability and quotation. Please include the following information so the required machine configuration can be checked:
Required quantity and preferred equipment condition
Substrate wafer format and thickness
Die dimensions and thickness
Component supply method
Required inspection and automation modules
Stand-alone or cluster installation
Delivery country
